**Odisha** has laid the foundation for **India’s first advanced 3D semiconductor packaging unit**, a project valued at approximately **₹2,000 crore** located at **Info Valley in Bhubaneswar**.  Developed by US-based **3D Glass Solutions** through its subsidiary **Heterogeneous Integration Packaging Solutions**, the facility marks a significant shift from traditional silicon substrates to advanced **3D glass substrate** technology. 

The plant is designed to produce **70,000 glass panels**, **50 million assembled units**, and **13,000 advanced 3D heterogeneous integration (3DHI) modules** annually, creating over **2,500 direct and indirect jobs**.  It aims to support critical sectors including **Artificial Intelligence**, **5G/6G communications**, **defence electronics**, and **high-performance computing**, thereby reducing India's dependence on imported chip packaging technologies. 

Commercial production is expected to commence by **August 2028**, with full-scale volume production targeted for **August 2030**.  This initiative complements Odisha’s status as the only state hosting both India’s first **compound semiconductor fabrication unit** and this advanced packaging facility, aligning with the **Atmanirbhar Bharat** mission to bolster domestic semiconductor manufacturing capabilities.

Sources⬇️  
1. [www.indiatoday.in](https://www.indiatoday.in/technology/news/story/india-gets-first-advanced-3d-chip-packaging-plant-intel-helping-it-set-up-in-odisha-2898846-2026-04-20)  
2. [www.hindustantimes.com](https://www.hindustantimes.com/india-news/indias-first-advanced-3d-glass-chip-unit-launched-in-odisha-101776626567425.html)  
3. [startuppedia.in](https://startuppedia.in/trending/odisha-gets-indias-first-3d-glass-semiconductor-project-with-2000-cr-investment-boost-set-to-create-2500-jobs-11754851)

India gets first advanced 3D chip packaging plant, Intel helping it set up in Odisha🥳🥳