Intel has set the bar high at ces.

Posted Jan 8, 2019, 5:51 AM UTC

Posted Jan 8, 2019, 5:51 AM UTC
Intel's new way to massively extend battery life: don't turn on the device in the first place.
Is the title meant to be sarcasm?
Because that's the only way I can see it makes any sense.
Definitely
You are correct. I laughed at their “demo” of a laptop powered off. What is the point of a chip company showing a powered off machine??
So intel did set the bar high, but AMD can raised it further.
I think AMD can do one better. AMD could be demonstrating their brand new 7nm mobile chip with a picture of an HP specter laptop.
So taking amd ''s chiplets concept after making fun of infinity fabric calling it "glued together". Just like every other major computing innovation AMD with its limited resources comes up with something great and Intel Co-opts it. You'd think with their huge R&D budget they'd be able to innovate on their own every once in a while.
AMD had the first implementation of a x86 FPU unit back in 1998 that Intel copied a year later with its first SSE implementation.
Same goes with the integrated memory controller, 64bit ISA, first dual core x86 server chip, memory encryption, separate secure processor, discreet compute core, etc...
AMD was primarily hindered (to the point of near bankruptcy) by its manufacturing deficiency (that its technological advantage could not offset) that became the most serious when they had to sign an agreement that they had to stay with global foundry for 15 years.
Now that AMD get access to the same fab as nvidia and those fabs are also competitive with Intel,
AMD will gain a lot of ground.
Its easy to see, you simply have to imagine if both company had switch foundry. Intel only allowed to manufacture at Global foundry, and AMD able to use the best foundry in the world (Intel)
That process lead now seem to be going away. I still believe this is why the stock went to $34 when it was announced that GF would not go 7nm.
The only thing that worries me is the new ISA (some new instructions/extensions basically)
The fact that 9th gen mobile CPUs are launching in 2Q of this year would indicate that the Icelake SKUs launching at end of year are only a small subset. The rest of Icelake U will launch in 2020.
Correct. With one side of the mouth they talk 10nm and yet with their actions they show 14nm for 2019. Course, the lithography process is less entertaining than their actual architectural ideas (which have validity). I sorta wish that AMD was looking into doing big/little with their current Zen arch.
Alternate title: Intel continues 4-year streak of promising that imaginary 10nm chips are, no, seriously this time, almost here.
Chiplet design is what caught my attention. Any eta on that?
Their Foveros approach looks not to be suitable for servers at all since the goal would be to catch up to AMD in cores and yields. Until the techology is perfected and each chiplet gluing operation has nearly 100% success rate there would be no competition against AMD's design.
The interposer would also probably be huge and could even surpass the reticle limit.
this does not make sense for servers yet. This really make sense when we start to run out of 2D real estate. (and when TDP is not a limiting factor)
Epyc2 and Epyc3 are safe.
But Intel could design a killer high end APU for premium laptops.
that's a bold statement about something neither of us have seen.
For a 64 core CPU, even if each chiplet has 8 cores, if the binding process of a chiplet is 95% successful then the yield from the packaging step alone, with everything else being perfect, drops by 40%.
Since we're only hearing about a single big core glued to a Atom chip, and getting that by late 2019, early 2020 gluing 8 dies with a massive interposer for server chips is going to be a bold step which may take a couple of years for us to see.
When it comes it may be competitive or even exceed in performance but the tech is going to be much more expensive vs what AMD is doing with Rome.
As I recall, someone in this sub made a bold statement that Intel would have MCM processors to compete with EPYC by early 2020 without having seen anything.
I said it was possible and frankly still think it's possible.
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I bet they're going to release 2 core chips with graphics disabled like the last set of 10nm chips. I'm sure the battery life will be very long on those laptops.
Yeah, but it's not like they have a recent track record of questionable demos or anything like that.
Our 10nm is totally coming. Oh and look over here, more 14nm chips.
how long have they been saying 10nm is coming 2016? It's now 2019 and I haven't seen a working 10nm from them
dont doubt their 10nm node. they dramatically scaled down the density as desmerjian said. so there is nothing special about the tech. their desktop chips are roughly the same density as Zen2 will be.
I don't think people are doubting the tech. But Intel's ability to deliver that tech when they say they will is a different story. I think investors should at least consider the potential that Intel might be misleading people here. Edit: typo
There inability to deliver has been due to going for to great a shrink. They have modified course and should be able to deliver. Their past failures have been due to issues with 10nm which was a function of poor management. Both if these have been fixed. While they could stumble again I would bank on it.
They will come out but low power laptops 4-6c close to EOY... wouldn't call that a success when AMD will have server chips out early this year...
U realize laptops are a huge market of about equal size as datacenter.
Datacenters and mobile products will be more dense. Only high performance desktop chips are similar density.
I think u are wrong about this just as u were wrong months ago saying 10nm would be only slightly less dense than originally designed. I told u 10nm would be least 10-20% less dense and may wind up the same as TSMC 7nm HPC. Turns out I was spot on in that call. So I will make another call. 10nm LP will he used only for face saving and will he on the lowest power mobile products. Maybe Foveros. Think tablets. 10nm HP will he used in CPU with low performance. Think Pentium and Celeron. Maybe i3 and Xeon bronze. 10nm UHP will be all the mobile/desktop/server where performance matters.
Physics applies to all and people make the same optimal design choices. So Intel UHP will be competing in the same space as Zen2. Intel HP and LP will be for specialty low power usage.